Synamic 6N
特點
● 高Tg 205℃ (DMA)● 低Dk/Df
● 更優異的耐熱性，Td＞400℃，T300＞60min
● 更低的Z軸熱膨脹系數，優異的通孔可靠性
● 更低的吸水率，優異的耐濕耐熱性
● 無鉛制程兼容
應用領域
● 超高速網絡設備
● 服務器、交換機、存儲、路由器、基站BBU等
● 高性能計算機
● 高頻測量儀器等
● 光通信產品
- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 205 |
| 2.4.25D |
DSC |
185 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 402 |
|
T288 |
2.4.24.1 | TMA | min | 120 |
| T300 |
2.4.24.1 |
TMA |
min |
60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 50 |
| After Tg | ppm/℃ | 210 | ||
| 50-260℃ | % | 2.0 | ||
|
Dissipation Constant |
2.5.5.9 (1GHz) |
C-24/23/50 |
- |
3.41 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 3.35 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 3.52 | |
|
Dissipation Factor |
2.5.5.9 (1GHz) |
C-24/23/50 |
- | 0.0013 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 0.0021 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 0.0026 | |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm [lb/in] | 0.82 [4.68] |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.10 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
1. All the typical value is based on the 0.76mm (6*2116) thickness specimen.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.