S7045G
特點
● 高Tg＞170℃ (DSC)，無鹵材料● 低插損，Dk/Df @1GHz: 4.30/0.010
● 更低的Z軸熱膨脹系數，優異的通孔加工性
● 優異的耐CAF性能
● 使用RTF銅箔能獲得更低的信號損耗
應用領域
● 服務器、交換機、路由器、基站、背板和線卡- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 175 | |
| Tg |
IPC-TM-650 2.4.24.4 |
DMA |
℃ |
190 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 390 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 40 | |
| After Tg | ppm/℃ | 210 | |||
| 50-260℃ | % | 2.3 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
|
Thermal Stress |
IPC-TM-650 2.4.13.1 |
288℃, solder dip |
-- |
PASS |
|
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.30 | |
|
IPC-TM-650 2.5.5.5 |
10GHz |
-- | 4.15 | ||
|
IEC 61189-2-721 |
10GHz | -- | 4.50 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.0100 | |
|
IPC-TM-650 2.5.5.5 |
10GHz |
-- | 0.0130 | ||
|
IEC 61189-2-721 |
10GHz | -- | 0.0130 | ||
| Peel Strength (1oz RTF copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.0 | |||
| 125℃ | N/mm | — | |||
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Remarks:
1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.