SDI06K
特點
● 無鉛兼容● 高Tg無鹵，Tg 220℃ (TMA)
● 較低的X/Y/Z軸CTE
● 低介質常數及損耗
應用領域
● 適用于智能手機，筆記本電腦，平板電腦，儀表盤，錄像機，電視，電子游戲機，通訊設備及汽車電子等- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 260 |
| 2.4.24 | TMA | 220 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 420 |
|
T288 |
2.4.24.1 | TMA | min |
＞60 |
| T260 |
2.4.24.1 |
TMA |
min |
＞60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 25-30 |
| 50-260℃ | % | 1.4 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50, RC50% | - | 4.0 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50, RC50% |
- | 0.0040 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 4.76×108 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 1.84×107 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 181 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | ＞45 |
|
Peel Strength (H Oz) |
2.4.8 |
A |
N/mm |
0.95 |
|
Flexural Strength (LW/CW) |
2.4.4 |
A |
GPa |
24/ 23 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.15 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
Remarks: 1. All the typical value is based on the1.0mm specimen. (*) is based on 0.10mm(1x2116) specimen.
2. All the typical value listed aboveis for your reference only, please turn to Shengyi Technology Co., Ltd fordetailed information, and all rights from this data sheet are reserved byShengyi Technology Co., Ltd.