Synamic9GN
特點
● 極低的Dk/Df@10GHz：3.34/0.0014● 高Tg，210℃（DMA）
● 更優異的耐熱性，Td＞400℃，T288＞60min
● 更低的Z軸熱膨脹系數，提供優異的通孔可靠性
● 更低的吸水率，優異的耐濕耐熱性
應用領域
● 超高速網絡設備（112G）
● AI服務器、交換機、存儲、路由器、基站BBU等
● 超級計算機
● 高頻測量設備等
- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.24.2 | DMA | ℃ | 210 |
| IPC-TM-650 2.4.24.1 | TMA | 180 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 400 |
|
T288 |
IPC-TM-650 2.4.24.1 | TMA | min | >60 |
| T300 |
IPC-TM-650 2.4.24.1 |
TMA |
min |
>60 |
|
Thermal Stress |
IPC-TM-650 2.4.13.1 |
288℃, solder dipping |
- | Pass |
| X/Y-CTE | IPC-TM-650 2.4.24.5 | TMA (30-120℃) | ppm/℃ | 12/13 |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 40 |
| After Tg | ppm/℃ | 140 | ||
| 50-260℃ | % | 1.5 | ||
|
Dielectric Constant (Dk) |
IPC-TM-650 2.5.5.9 (1GHz) |
C-24/23/50 |
- |
3.25 |
|
IEC61189-2-721 (10GHz) |
C-24/23/50 |
- | 3.34 | |
| BCDR (14GHz) | C-24/23/50 | - | 3.15 | |
|
Dissipation Factor (Df) |
IPC-TM-650 2.5.5.9 (1GHz) |
C-24/23/50 |
- | 0.0005 |
|
IEC61189-2-721 (10GHz) |
C-24/23/50 |
- | 0.0014 | |
| BCDR (14GHz) | c-24/23/50 | - | 0.0014 | |
| Peel Strength (1Oz) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm | 0.53 |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.06 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Explanations: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.
The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in ℃ and with the third digit the relative humidity.
Remarks:
1. All the typical value is based onthe 0.76mm (10*1078 RC66%) thickness specimen, but not guarantee data.
2. All the typical value listed aboveis for your reference only, please turn to ShengyiTechnology Co., Ltd. for detailed information, and all rights from this datasheet are reserved by Shengyi Technology Co., Ltd.