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SP168GN
Characteristic
- Excellentmechanical processability, punching process applicable.
- Minimal resin flow, flexible andnearly powderless contamination.
- Hi-Tgand halogen free.
Application Area
Suitablefor bonding use in heat sink board, die cavity board andmultilayer rigid-flex PCB applications.
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 165 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 380 | |
| CTE（Z-axis） | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 70 | |
|
After Tg |
ppm/℃ | 300 | |||
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | >30 | |
| Thermal Stress | IPC-TM-650 2.4.24.13 | 288℃, solder dip | -- |
>600S |
|
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 3.85 | |
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.013 | |
| Peel Strength | IPC-TM-650 2.4.8 | Copper (1/2 oz) | N/mm | 1.2 | |
| Copper (1 oz) | N/mm | 1.5 | |||
| CVL | N/mm | 1.0 | |||
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105_d-2/23 | % | 0.14 | |
| Flammability | UL94 |
E-24/125 |
Rating | V-0 | |
Remarks:
1.Specimenthickness: 0.8mm. All the typical value listed above is for your referenceonly, please turn to Shengyi TechnologyCo., Ltd. for detailed information.
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.