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SF206C
Characteristic
● Low dielectric constant,low dissipation loss.
● Excellent thermal resistance,chemicalresistance and electrical property
● Halogen-free, flammabilityUL94 V-0
● Good processability,suitablefor both fast andtraditional lamination style
● Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE,etc..
Application Area
Be used in high frequency FPC and rigid-flex PCB- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength(90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 0.92 |
| 288℃、5s | 0.92 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃、10s | - |
No delamination |
| Dimensional Stability |
SY Method |
After peeling off the paper | % | -0.0223/-0.0393 |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞85 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 98 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
4.19×109 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
2.34×106 |
| Dielectric Constant(10GHz) | SPDR | C-24/23/50 | - | 2.7 |
| Dissipation Factor(10GHz) | SPDR |
C-24/23/50 |
- | 0.004 |
| Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm | ＜0.15 |
| Flammability | UL94 | E-24/125 | Rating |
V-0 |
Remarks:
*Testing after laminating with shining side of copper foil in suitablecondition
1.Certified to IPC-4203/21 Poyimide dielectric with polyimide adhesive
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.