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Smart Terminal
Rigid Materials
RF Materials
Automotive Materials
Flexible Materials
IC Substrate Materials
IMS and HTC materials
Special Materials
HSD Materials
- Environmental Material
- Extremely low-loss
- 環保材料
- HDI
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
- 不流動P片
- 其它
- 超低介質損耗
- 低介質損耗
- 疊層母排用絕緣膠膜
- CEM-1
- CEM-3, CEM-3.1
- PTFE Type
- 熱固性樹脂體系
- 硬質聚酰亞胺材料
- 半撓性材料
- 特種粘合材料
- 中等介質損耗
- 鋁基板
- 銅基板
- 撓性覆銅板
- 覆蓋膜
- 膠膜
- 補強板
- 常規FR-4.0
- 無鉛兼容FR-4.0, FR-15.0
- 無鹵無鉛兼容FR-4.1, FR-15.1
- IC Substrate
- 涂樹脂銅箔
- 碳氫系列產品
- 導熱FR-4.0
- 汽車產品
- 智能終端產品
- 常規剛性產品
- 汽車產品
- 射頻與微波材料
- 金屬基板與高導熱產品
- IC封裝產品
- 軟性材料產品
- 高速產品
- 特種產品
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- 2014
- 2015
- 2016
- 2017
- 2018
- 2019
- 2020
- 2021
- 2022
- 2023
- 2024
- HDI
- HDI
- UL File (Download)
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- Conventional FR-4
- Lead Free Compatible FR-4.0, FR-15.0
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- CEM-3, CEM-3.1
- CEM-1
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- 臺灣
- 東莞
- 蘇州
- 咸陽
- 韓國
- 歐洲
- 美國中北大道
- 美國森林大道
- 日本
- 東南亞
- 巴西
- 東莞萬江
- 咸陽
- 蘇州
- 常熟
- 南通
- 九江
- 研發及工程化對外業務
- 委托測試對外業務
- 知識產權和標準對外業務
- 人才培養和技術培訓
- CQC Certificate
- BSI Certificate
- JET Certificate
- VDE Certificate
- UL File (UL IQ link)
- Education
- Environmental Protection
- Society
- Shengyi Technology
- Shaanxi Shengyi
- Suzhou Shengyi
- Changshu Shengyi
- Jiangsu Shengyi
- Jiangxi Shengyi
- Hong Kong Shengyi
- Taiwan Shengyi
- 資教助學
- 環保活動
- 回饋社會
- 廣東生益
- 陜西生益
- 蘇州生益
- 常熟生益
- 江蘇生益
- 江西生益
- 香港生益
- 臺灣生益
- 臺灣
- PTFE Type
- 熱固性樹脂體系
- 硬質聚酰亞胺材料
- 半撓性材料
- 特種粘合材料
- 中等介質損耗
- 低介質損耗
- 超低介質損耗
- 撓性覆銅板
- 覆蓋膜
- 不流動P片
- 膠膜
- 補強板
- 疊層母排用絕緣膠膜
- 東莞
- 蘇州
- 咸陽
- 韓國
- 歐洲
- 美國中北大道
- 美國森林大道
- 日本
- 東莞萬江
- 咸陽
- 蘇州
- 常熟
- 南通
- 九江
- 東南亞
- 巴西
- 常規FR-4.0
- 無鉛兼容FR-4.0, FR-15.0
- 無鹵無鉛兼容FR-4.1, FR-15.1
- CEM-1
- CEM-3, CEM-3.1
- IC Substrate
- 涂樹脂銅箔
- 碳氫系列產品
- 鋁基板
- 銅基板
- 導熱FR-4.0
- 其它
- UL檔案
- UL認證（查詢）
- CQC認證
- BSI認證
- JET認證
- VDE認證
- 三會規則
- 工作制度
- 內部控制
- 研發及工程化對外業務
- 委托測試對外業務
- 知識產權和標準對外業務
- 人才培養和技術培訓
- 聯系方式
- 汽車產品
- Environmental Material
- Extremely low-loss
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
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Product List
- product name
- Product brief description
- CTI
- Thermal conductivity（W/m·K）
- Df/10GHz
- Dk/10GHz
- application area
- Dk
- Df
- CTE
- Tg
- Td
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