S6015
特點
● 不含鹵素，無玻纖增強材料，適用于常規HDI制作工藝● 不掉樹脂粉，污染少
● 可與常規FR-4.0半固化片媲美的保存期
● 較低的介電常數，有利于特性阻抗控制及提高信號傳輸速度
應用領域
● 適用于制作無鹵化趨勢的手持式電子產品，如手機、PDA、數碼攝像機等- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.25D |
DSC |
℃ | 145 |
|
Thermal Stress |
2.4.13.1 |
288℃/20s |
- | pass |
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50 | - | 3.4 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.018 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 5 x 108 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 5 x 109 |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm | 1.2 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.