SF325B
特點
● 粘接強度高。
● 不含鹵素，阻燃性達到UL94 VTM-0級。
● 優秀的耐熱性、耐化學性和電性能。
● 優異的耐離子遷移性，不長枝狀結晶。
● 溢膠量低，加工性好，適于快速壓合和傳統壓合。
● 滿足RoHS指令要求，不含鉛、汞、鎘、六價鉻、多溴聯苯、多溴聯苯醚等。
應用領域
多層撓性印制板和剛撓性印制板等用粘接膜- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.7 |
| 288℃, 5s | 1.6 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
96.2 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
8.0×107 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
8.5×106 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 3.4 |
| Dissipation Factor (10GHz) | SPDR | C-24/23/50 | - | 0.017 |
| Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm |
＜0.15 |
|
Flammability |
UL94 |
E-24/125 |
Rating |
VTM-0 |
Remarks:
*Testing after laminating with shining side of copper foil and PI film insuitable condition.
1.Certified to IPC-4203/20 Unsupportedpolyester adhesive
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.