SP175M
特點
● 無鉛兼容● 優良的耐熱可靠性
● 低的Z軸熱膨脹系數
● 低吸水率
應用領域
● 適用于高厚徑比和高多層PCB
● 廣泛應用于計算機、通訊設備、精密儀器、儀器儀表、路由器等
- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 175 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 348 |
|
T288 |
2.4.24.1 | TMA | min | 20 |
| T260 |
2.4.24.1 |
TMA |
min |
60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | ＞60s No Delamination |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 56 |
| After Tg | ppm/℃ | 326 | ||
| 50-260℃ | % | 3.8 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50 | - | 3.6 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.0164 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 4.6 x 106 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 7.9 x 105 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 90 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | 45+kV NB |
| Peel Strength (1oz) | 2.4.8 | 288℃/10s | N/mm | 1.3 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.20 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
| CTI | IEC60112 | A | Rating | PLC3 |
Remarks:
1. Specimen thickness: 1.8mm. Test method is according to IPC-TM-650.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.