LNB33C
特點
● 玻璃布增強碳氫化合物和陶瓷電介質● 減少PIM
● 各頻率下穩定的電氣特性
● 低Z軸膨脹系數和出色的尺寸穩定性
● 無鉛工藝兼容性
應用領域
● 高頻無線通信● 蜂窩基站天線
● WiMAX天線網絡
- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit |
Direction |
Typical Value |
| Dielectric Constant, Dk | IPC-TM-650 2.5.5.5 | C-24/23/50, 10GHz | - | Z | 3.30±0.05 |
| Dielectric Constant, Dk | IPC-TM-650 2.5.5.15 | C-24/23/50, 10GHz | - | X/Y | 3.56±0.05 |
| Dissipation Factor, Df | IPC-TM-650 2.5.5.15 | C-24/23/50, 10GHz | - | X/Y | 0.0030 |
| Thermal Coefficient of Dk | IPC-TM-650 2.5.5.5 | -55 to 85℃ | ppm/℃ | Z | +50 |
| PIM |
43dBM
1900MHz
|
50 ohm
0.0307"
|
dBc | -158 | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | COND A | MΩ·cm | 6.8 x 108 | |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | COND A | MΩ | 5.3 x 107 | |
| Flexual Strength | IPC-TM-650 2.4.4 | R.T. | MPa | X/Y | 200/160 |
| CTE | IPC-TM-650 2.4.24 | 50~260℃ | ppm/℃ | Z | 55 |
| IPC-TM-650 2.4.41 | 50~260℃ | ppm/℃ | X/Y | 12/12 | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | ＞280 | |
| Td | IPC-TM-650 2.4.24.6 | TGA (5% wt. loss) | ℃ | 400 | |
| Thermal Conductivity | ASTM D5470 | 50℃ | W/(m·k) | Z | 0.65 |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.05 | |
| Peel Strength (1oz HVLP) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm [lb/in] | 1.05 [6.0] | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 |
Remarks:
1. All the typical value is based on the 0.780(0.0307") thickness specimen, but not guarantee data.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.