SP168GN
特點
● 優異的機械加工性，適合壓合工藝。
● 極小流膠，可撓曲加工極少碎屑。
● 高Tg無鹵。
應用領域
適合用作散熱板、多層板及軟硬結合板粘結層- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 165 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 380 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 70 | |
|
After Tg |
ppm/℃ | 300 | |||
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | >30 | |
| Thermal Stress | IPC-TM-650 2.4.24.13 | 288℃, solder dip | -- | >600S | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 3.85 | |
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.013 | |
| Peel Strength | IPC-TM-650 2.4.8 | Copper (1/2 oz) | N/mm | 1.2 | |
| Copper (1 oz) | N/mm | 1.5 | |||
| CVL | N/mm | 1.0 | |||
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105_d-2/23 | % | 0.14 | |
| Flammability | UL94 |
E-24/125 |
Rating | V-0 | |
Remarks:
1.Specimenthickness: 0.8mm. All the typical value listed above is for your referenceonly, please turn to Shengyi TechnologyCo., Ltd. for detailed information.
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.