SF230
特點
● 較低的介電損耗，插損接近LCP。
● 優秀的耐熱性、尺寸穩定性、耐化學性及電性能。
● 不含鹵素，阻燃性達到UL94 VTM-0級。
● 滿足RoHS指令要求，不含鉛、汞、鎘、六價鉻、多溴聯苯、多溴聯苯醚等。
應用領域
高速電路用撓性印制板和剛撓性印制板- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°) | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.36 |
| 288℃, 5s | 1.47 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Dimensional Stability | IPC-TM-650 2.2.4B |
After Etched |
% | 0.0149/-0.0360 |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞95 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 201 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
1.23×109 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
4.53×106 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 3.2 |
| Dissipation Factor (10GHz) | SPDR |
C-24/23/50 |
- | 0.0056 |
| Folding Endurance | JIS C-6471 |
R0.8×4.9N |
Times | ＞500 |
| Flammability | UL94 | E-24/125 | Rating |
VTM-0 |
Remarks:
1.Certified to IPC-4204/11 Copper Clad Adhesiveless
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.